Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148677 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua | 2024-11-19 |