Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11993862 | Structure including copper plating layer or copper alloy plating layer | Hironori Murakami, Fuka Yamaoka | 2024-05-28 |
| 11946153 | Copper or copper alloy electroplating bath | Hironori Murakami, Fuka Yamaoka | 2024-04-02 |
| 11939691 | Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath | Syohei Yamaguchi, Hiroki Ishida, Shoya Iuchi | 2024-03-26 |