Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12150388 | Electroplating for vertical interconnections | Kok Wai Chan, Hasnain Ahmad, Manjunath Ramachandrappa Venkatesh, Wei Liu, Lily Yang +5 more | 2024-11-19 |
| 12074114 | Chip fabrication method and product including raised and recessed alignment structures | Kok Wai Chan, Kuan Yen Tan | 2024-08-27 |
| 11907805 | Three-dimensional superconducting qubit and a method for manufacturing the same | Caspar Ockeloen-Korppi, Tianyi Li, Wei Liu, Vasilii Sevriuk, Tiina Naaranoja +4 more | 2024-02-20 |