Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11859685 | Formation method for liquid rubber composite nodes with damping through holes | Jun Luo, Haitao Cheng, Wensong Liu, Sheng Lin, Wansheng Feng +2 more | 2024-01-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11859685 | Formation method for liquid rubber composite nodes with damping through holes | Jun Luo, Haitao Cheng, Wensong Liu, Sheng Lin, Wansheng Feng +2 more | 2024-01-02 |