Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112956 | Chip interconnection package structure and method | Yao-Chang Wang, Zibai Li, Yunzhi LING, Xun XIANG, Chuan Hu +1 more | 2024-10-08 |
| 11869872 | Chip stack packaging structure and chip stack packaging method | Yao-Chang Wang, Yunzhi LING, Chuan Hu, Zibai Li, Wei Zhao +1 more | 2024-01-09 |