Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996663 | Bonding device, bonding structure for wearable device and node device for forming sensing point on signal connecting line thereof | Chun-Yuan Huang | 2024-05-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996663 | Bonding device, bonding structure for wearable device and node device for forming sensing point on signal connecting line thereof | Chun-Yuan Huang | 2024-05-28 |