Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068286 | Device with embedded high-bandwidth, high-capacity memory using wafer bonding | Khandker N. Quader, Robert Norman, Frank Sai-keung Lee, Christopher J. Petti, Scott Brad Herner +3 more | 2024-08-20 |
| 11923341 | Memory device including modular memory units and modular circuit units for concurrent memory operations | Khandker N. Quader, Robert Norman, Frank Sai-keung Lee, Christopher J. Petti, Scott Brad Herner +3 more | 2024-03-05 |