Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923148 | Substrate-type multi-layer polymer capacitor (MLPC) having electroplated terminal structure | I-Chu Lin, Qiwei Chen | 2024-03-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923148 | Substrate-type multi-layer polymer capacitor (MLPC) having electroplated terminal structure | I-Chu Lin, Qiwei Chen | 2024-03-05 |