Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11987701 | Thermosetting resin compositions, liquid packaging material, film, semiconductor package, interlayer insulating film, and flame-retardant resin composition | — | 2024-05-21 |
| 11945913 | Thermosetting polyimide resin and manufacturing method thereof, composition, prepolymer, film, adhesive, and use thereof | — | 2024-04-02 |