Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087647 | Compound closed-type metal lid for semiconductor chip package | Ying-Lin Hsu | 2024-09-10 |
| 11935800 | Compound metal lid for semiconductor chip package | Ying-Lin Hsu | 2024-03-19 |