Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12162790 | Overflow brick and sheet forming thickness control method therefor | Miao Li, Menghu LI, Dacheng Wang, Zhijun Zhang | 2024-12-10 |
| 11952487 | Resin spacer for chip stacking and packaging and preparation method thereof | — | 2024-04-09 |