Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11864329 | Packaging structure with embedded electronic components and method for manufacturing the same | Chih-Chieh Fu, YUAN-YU LIN | 2024-01-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11864329 | Packaging structure with embedded electronic components and method for manufacturing the same | Chih-Chieh Fu, YUAN-YU LIN | 2024-01-02 |