Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11972537 | Method, system, and non-transitory computer-readable medium for flattening three-dimensional shoe upper template | Chih-Chuan Chen, Wei-Hsiang Tsai, Chin-Yu Chen, Ching-Cherng Sun, Jann-Long CHERN | 2024-04-30 |
| 11973039 | Semiconductor device package and method of manufacturing the same | Chia-Hao Sung, Hsuan-Yu Chen | 2024-04-30 |