Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11997798 | Package substrate and method for manufacturing the same | Hsing Kuo Tien, Chih-Cheng Lee, Min-Yao CHEN | 2024-05-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11997798 | Package substrate and method for manufacturing the same | Hsing Kuo Tien, Chih-Cheng Lee, Min-Yao CHEN | 2024-05-28 |