Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916155 | Optoelectronic package having second encapsulant cover first encapsulant and photonic devices | Chien-Hsiu Huang, BO-JHIH CHEN, KUO-MING CHIU, Meng-Sung Chou, Kai-Chieh Liang +2 more | 2024-02-27 |