Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973004 | Mechanical architecture for a multi-chip module | Robert Y. Cao, Mitchell Heschke, Mengzhi Pang, Shishuang Sun | 2024-04-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973004 | Mechanical architecture for a multi-chip module | Robert Y. Cao, Mitchell Heschke, Mengzhi Pang, Shishuang Sun | 2024-04-30 |