Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148715 | Electronic device including a substrate, a structure, and an adhesive and a process of forming the same | — | 2024-11-19 |
| 11942405 | Semiconductor package assembly using a passive device as a standoff | Jianguo Li | 2024-03-26 |