Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165981 | 3D semiconductor package with die-mounted voltage regulator | Gabriel H. Loh, Rahul Agarwal, Brett P. Wilkerson | 2024-12-10 |
| 11911839 | Low temperature hybrid bonding | Priyal Shah, Rahul Agarwal, Brett P. Wilkerson | 2024-02-27 |