Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11956897 | Semiconductor package device and method of manufacturing the same | Chia-Ching Chen, Yi Ding | 2024-04-09 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11956897 | Semiconductor package device and method of manufacturing the same | Chia-Ching Chen, Yi Ding | 2024-04-09 |