Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12126884 | Substrate to place components for camera size reduction | Qi Wang, Ashirwad Bahukhandi, Daniel R. Hennigan | 2024-10-22 |
| 12088897 | Camera module flexure with segmented base layer | Himesh Patel, Phillip R. Sommer, Qiang Yang | 2024-09-10 |
| 11962881 | Variable polyimide thickness to control pad impedance | Himesh Patel, Phillip R. Sommer, Pavle Stojanovic, Qiang Yang | 2024-04-16 |