Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955346 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Shijian Luo | 2024-04-09 |
| 11923329 | Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology | — | 2024-03-05 |