Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040306 | Systems of applying materials to components | Michael S. Wladyka, Keith David Johnson, Jingting Yang, Kevin Joel Bohrer, Mark D. Kittel | 2024-07-16 |
| 11984570 | Thermal management and/or EMI mitigation materials including coated fillers | John Song | 2024-05-14 |
| 11864366 | Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder | — | 2024-01-02 |