Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11909558 | Port mapping for bonded interfaces of ECMP group | Dexiang Wang, Jia Yu, Jayant Jain, Mike Parsa | 2024-02-20 |
HL
Haihua Luo
Overall (2024): #450,505 of 561,600Top 85%
1
Patents 2024