Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183693 | Integrated magnetic assembly with conductive field plates | — | 2024-12-31 |
| 12170164 | Integrated high voltage electronic device with high relative permittivity layers | — | 2024-12-17 |
| 12027572 | Integrated semiconductor device isolation package | — | 2024-07-02 |
| 11935844 | Semiconductor device and method of the same | — | 2024-03-19 |
| 11879790 | Isolated temperature sensor package with embedded spacer in dielectric opening | — | 2024-01-23 |
| 11881461 | Electric field control for bond pads in semiconductor device package | — | 2024-01-23 |
| 11881445 | High voltage semiconductor device lead frame and method of fabrication | — | 2024-01-23 |