Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136608 | Multi-chip package | Yong Chen | 2024-11-05 |
| 11996397 | Wafer level proximity sensor | — | 2024-05-28 |
| 11942496 | Slanted glass edge for image sensor package | Laurent Herard | 2024-03-26 |
| 11908831 | Method for manufacturing a wafer level chip scale package (WLCSP) | Chun Yi Teng | 2024-02-20 |