Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176320 | Semiconductor structure and methods for bonding tested wafers and testing pre-bonded wafers | Wenliang Chen | 2024-12-24 |
| 12074103 | Circuit assembly | Wenliang Chen, Jun Gu, Masaru Haraguchi, Takashi Kubo, Chun-Yi Lin | 2024-08-27 |