Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12157815 | Polyimide resin composition, polyimide resin adhesive layer, laminate, and manufacturing method of electronic component | Yung-Yu Lin, Che-Wei Chang | 2024-12-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12157815 | Polyimide resin composition, polyimide resin adhesive layer, laminate, and manufacturing method of electronic component | Yung-Yu Lin, Che-Wei Chang | 2024-12-03 |