Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12069967 | Integrated circuit including two substrates with qubits disposed within one of the two substrates | — | 2024-08-20 |
| 11862593 | Electroplated indium bump stacks for cryogenic electronics | Richard P. Rouse | 2024-01-02 |