Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165981 | 3D semiconductor package with die-mounted voltage regulator | Gabriel H. Loh, Raja Swaminathan, Rahul Agarwal | 2024-12-10 |
| 12107075 | Hybrid bonded interconnect bridging | Lei Fu, Rahul Agarwal | 2024-10-01 |
| 11911839 | Low temperature hybrid bonding | Priyal Shah, Rahul Agarwal, Raja Swaminathan | 2024-02-27 |