Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12000664 | Heat exchanger | Chad Chung Lau, Don S. George | 2024-06-04 |
| 11997824 | Systems and methods for providing a high performance air-cooled chassis for electronic modules | David J. Sugimoto | 2024-05-28 |
| 11930613 | Electronic assembly with glide surfaces and related methods | Lawrence P. Ludwig | 2024-03-12 |
| 11925005 | Systems and methods for pneumatic release manifold sealing | — | 2024-03-05 |
| 11881671 | Method for making an interconnect device for electronic circuits | Voi Nguyen | 2024-01-23 |