Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11982850 | Optical micro-electromechanical system with flip chip packaging | Hongbo Zhang, Hengjiang Ren, Jie Luo | 2024-05-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11982850 | Optical micro-electromechanical system with flip chip packaging | Hongbo Zhang, Hengjiang Ren, Jie Luo | 2024-05-14 |