Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12182051 | Multi-purpose IO pads/bumps on semiconductor chips to maximize chip-to-chip data connectivity | — | 2024-12-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12182051 | Multi-purpose IO pads/bumps on semiconductor chips to maximize chip-to-chip data connectivity | — | 2024-12-31 |