Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12024788 | Bonding copper wire plated with palladium and gold and electroplating process thereof | Shi-Ping Liu, Yi-Chun Liu | 2024-07-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12024788 | Bonding copper wire plated with palladium and gold and electroplating process thereof | Shi-Ping Liu, Yi-Chun Liu | 2024-07-02 |