Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12180067 | Sensor with integrated heater | Pei-Wen Yen, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus | 2024-12-31 |
| 12139398 | Pressure sensor with high stability | Weng Shen Su, Chung-Hsien Lin, Yaoching Wang, Tsung Lin Tang, Calin Miclaus | 2024-11-12 |
| 12140489 | Pressure sensor with high stability | Tsung Lin Tang, Chung-Hsien Lin, Weng Shen Su, Yaoching Wang | 2024-11-12 |
| 12034277 | Semiconductor layer structure with a thin blocking layer | Xing Li, Hery Djie | 2024-07-09 |
| 11864351 | Heat dissipation structure using heat pipe | Xiao-Yao Li, Yu Feng | 2024-01-02 |