Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12025971 | Socket interposer for system-in-package (SIP) module qualification in product platform validation (PPV) setup | Samarth Alva, Amarjeet Kumar, Gaurav Hada | 2024-07-02 |
| 11966268 | Apparatus and methods for thermal management of electronic user devices based on user activity | Columbia Mishra, Carin Ruiz, Helin Cao, Soethiha Soe, James G. Hermerding, II +1 more | 2024-04-23 |