Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12147377 | Distributed multi-die protocol application interface | Gary Brian Wallichs, Cora Lynn Mau | 2024-11-19 |
| 12135667 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones | 2024-11-05 |
| 12086088 | Multichip package with protocol-configurable data paths | Huy Ngo, David W. Mendel | 2024-09-10 |