Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176318 | Thermal compression bonder nozzle with vacuum relief features | Mihir A. Oka, Kartik Srinivasan, Wei Tan | 2024-12-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176318 | Thermal compression bonder nozzle with vacuum relief features | Mihir A. Oka, Kartik Srinivasan, Wei Tan | 2024-12-24 |