Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009298 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Lai Guan Tang, Han Wooi Lim | 2024-06-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009298 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Lai Guan Tang, Han Wooi Lim | 2024-06-11 |