Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176284 | Through plate interconnect for a vertical MIM capacitor | Travis W. Lajoie, Abhishek A. Sharma, Juan G. Alzate-Vinasco, Chieh-Jen Ku, Shem Ogadhoh +6 more | 2024-12-24 |
| 12080643 | Integrated circuit structures having differentiated interconnect lines in a same dielectric layer | Travis W. Lajoie, Abhishek A. Sharma, Juan G. Alzate Vinasco, Chieh-Jen Ku, Shem Ogadhoh +6 more | 2024-09-03 |