Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11917750 | Shielding structure for system-in-package and electronic device | Huijuan Wang, Jinsen Cai, Bin Hu, Bo Kong | 2024-02-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11917750 | Shielding structure for system-in-package and electronic device | Huijuan Wang, Jinsen Cai, Bin Hu, Bo Kong | 2024-02-27 |