Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176172 | Power relay circuit | Ingo Muri | 2024-12-24 |
| 12014973 | Multi-die-package and method | Andreas Riegler | 2024-06-18 |
| 11869966 | Method for forming an insulation layer in a semiconductor body and transistor device | Hans Weber, Franz Hirler, Winfried Kaindl, Markus Rochel | 2024-01-09 |