Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170226 | Method for separating dies from a semiconductor substrate | Benjamin Bernard, Mario Stefenelli | 2024-12-17 |
FP
Franz-Josef Pichler
Overall (2024): #465,541 of 561,600Top 85%
1
Patents 2024