Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11964915 | Ceramic material and wire bonding capillary | Tien-Heng Huang, Yu-Han WU | 2024-04-23 |
| 11939268 | Low-k material and method for manufacturing the same | Tzu-Yu Liu, Tien-Heng Huang, Tzu-Chi Chou, Cheng-Ting Lin | 2024-03-26 |