Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955404 | Electronic package and heat dissipation structure thereof, comprising bonding pillars | Chien-Yu Chen, Wei-Hao Chen | 2024-04-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955404 | Electronic package and heat dissipation structure thereof, comprising bonding pillars | Chien-Yu Chen, Wei-Hao Chen | 2024-04-09 |