Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12090579 | High reliability lead-free solder alloys for harsh environment electronics applications | Weiping Liu | 2024-09-17 |
| 11999018 | SnBi and SnIn solder alloys | Francis M. Mutuku, Hongwen Zhang | 2024-06-04 |