Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967548 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Kerry Bernstein, Bruno Michel | 2024-04-23 |
| 11880755 | Semi-supervised learning with group constraints | Patrick Lustenberger, Andrea Giovannini, Adam Ivankay | 2024-01-23 |