Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062574 | Integrated circuit structure with through-metal through-substrate interconnect and method | Zhong-Xiang He, Alvin J. Joseph, Ramsey Hazbun, Jeonghyun Hwang, Mark D. Levy | 2024-08-13 |