Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12150390 | Downstop and bump bonds formation on substrates | David W. Abraham | 2024-11-19 |
| 12033981 | Create a protected layer for interconnects and devices in a packaged quantum structure | David W. Abraham, Oliver Dial, Kevin S. Petrarca | 2024-07-09 |
| 11908756 | Interposer chips and enclosures for quantum circuits | David W. Abraham | 2024-02-20 |