Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12073858 | Mechanism to shift the head span of a tape head at a wafer level | Icko E. T. Iben, Jason Liang | 2024-08-27 |
| 12033678 | Cable bonding protection for head dimensional stability | Jason Liang, Daniel G. Brown | 2024-07-09 |