Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11992837 | Fluidic cavities for on-chip layering and sealing of separation arrays | Joshua T. Smith, Benjamin H. Wunsch | 2024-05-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11992837 | Fluidic cavities for on-chip layering and sealing of separation arrays | Joshua T. Smith, Benjamin H. Wunsch | 2024-05-28 |